JavaScript disabled!
Вход
Логин
Пароль
Проблемы с доступом
Меню
Пресс-офис
Мероприятия по энергетике
Анонсы российских мероприятий – 2024
Анонсы зарубежных мероприятий – 2024
Архив прошедших мероприятий
Архив зарубежных мероприятий
Архив российских мероприятий
Обзоры прошедших мероприятий
Инструкция по работе с ЭТБ "ГИС-Профи"
База по оборудованию
Документация по оборудованию
Каталог продукции компаний партнёров
Поставщики продукции и услуг
Презентационные материалы
О проекте
Информационные исследования
Реклама в информационной системе
Корпоративные пользователи
Контакты
Корпоративный доступ
База международных стандартов
IEC / МЭК
IEC 60191-6-13:2007. Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array
IEC 60191-6-16:2007. Mechanical standardization of semiconductor devices – Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
IEC 60191-6-18 (First edition – 2010) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor
IEC 60191-6-1862010. Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-19:2010. Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
IEC 60191-6-2 (First edition – 2001). Mechanical standardization of semiconductor devices – Part 6-2
IEC 60191-6-2:2001. Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-20:2010. Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2009. Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-21:2010. Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
152
153
154
155
156
157
158
159
160
161